Galaxy S7 is the next big flagship from Samsung that the world is expecting. With the immense success of the Galaxy S6 and its Edge counterparts, the Korean giant is not shying away from being more innovative. Asides, it is hellbent on doing something grand on this phone mainly because of the recent allegations of stealing Apple designs, that is going to end in a nasty compensation payment.
As for the Galaxy S7, the leaks and rumors have already started running full blast and we have been able to round of some of the top rumors that we have heard.
One of the greatest challenges that this phone has heard is the heating of devices. The Galaxy S5 that came with an ugly perforated back cover was the first to face a severe issue, where the phone actually seemed to face immense heat causing people to have to turn off their devices in fear of damage. This issue might finally be addressed with the launch of the Galaxy S7.
According to some reports over the internet, the South Korean giant will be working on the liquid cooling technology for the future Samsung devices in the higher price bracket. Although they have not declared this specifically, its recent activities surrounding the employment of services from a supplier that deals with heat pipe supplies. The technology includes the heat from circuit boards to be passed over pipes that are filled with liquid. When the device starts to heat up, the liquid is able to absorb the heat, thus keeping important components within the phone, like the SoC from heating up and getting damaged in the process.
The company intends to continue using the same material that it had used for the Galaxy S6 and S6 Edge phones, that is glass metal combination. This would create problems for the device as it tends to heat up really quick. But this would not really matter, as the liquid cooling technology would be able to safely direct the heat away from the internal components of the phone.